Packaging, the boom begins to transfer to the packaging link, Mini related packaging equipment demand is also worth paying attention to. Packaging, benefiting from the uptrend of display and backlight economy, we see that the 3-4Q activity rate of China Xingguang Electric (not covered) and other packaging factories is also significantly up, and the future MiniLED demand will also significantly increase the demand for packaging particles. Packaging equipment,Mini/MicroLED requires massive volume transfer and solidification, and there is technical innovation.
4012AW LED
4012AW 0.40 inch
4012BW 7-Segment
4012BW Display
Furthermore, MicroLED technology places unprecedented demands on packaging processes, making innovation in this segment a key competitive differentiator. Unlike traditional LED packaging, MicroLED requires ultra-high precision in mass transfer, alignment, and bonding, as millions of microscopic chips must be accurately placed onto substrates within a very short time. This has driven the development of advanced solutions such as laser-assisted transfer, elastomer stamp transfer, and fluidic self-assembly, all of which aim to improve efficiency and yield while reducing production costs.
display
18011AGG display
18011AGG CC Common-Anode CA
18011BGG 1.80-inch
18011BGG
