Bonding should be bonded between the wafer layer and the substrate through the metal layer, and reflect photons at the same time to avoid the absorption of the substrate, conductive Si substrate instead of LED chip GaAs substrate, with good thermal conductivity (thermal conductivity difference of 3-4 times), more suitable for the field of high driving current. 4, the bottom of the metal reflector, is conducive to the promotion of luminosity and heat dissipation.
3261AB Blue
3261AB LED
3261AB 0.36 inch
3261AB
3261BB LED
3261BB segment
3261BB Display
3261BB
